The key advantages of Sensilica sensors are derived from a novel manufacturing approach and design methodology that reduces sensor size by a factor of four compared to most existing solutions. Sensilica utilizes a unique proprietary process resulting in the creation of a buried cavity inside the silicon, yielding an extremely thin, ultra-sensitive “All-Silicon” device. This simplified “All-Silicon” approach eliminates the need to bond wafers to create a reference cavity thereby significantly reducing manufacturing cost and improving overall reliability.